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Announcement Letter From Ventec International

Feb 26, 2021
Dear Our Valued Customers and Business Partners:
       Thank you for your long-standing support for Ventec International. We are delighted to be able to share with you that Ventec International (TWSE:6672), BizLink Holding Inc. (TWSE:3665) and Footprintku Inc. have completed the signing ceremony to seal an important strategic alliance on February 26, 2021. 
       This agreement further integrates the resources of supply chain partners from the three parties with proposed delivery through the cloud platform. The primary objective of the strategic alliance is to share the respective expertise of the three companies and deploy that globally. In other words, through the extensive information on customer groups and their business needs, applications can be integrated to consolidate and streamline our mutual supply chains. In addition, through this collaboration, full technical interchanges can facilitate the optimization of product development processes. The integration of big data can also connect highly flexible, dedicated, and bespoke electronics industry supply chain partners to help accelerate product evolution and drive industrial innovation.
       Ventec International is here to provide you with the most complete industrial supply chain, as well as more convenient and focused one-stop free consulting services. Our domains include upstream substrate materials, PCB circuit design, PCB board manufacturing recommendations, electronic wiring harness and interconnector component solutions, and AI big data conversion technology. Our goal is to create the world's largest platform in the electronic component industry.

Following is an overview of the three companies in this strategic platform:

Ventec International (TWSE:6672)

       Ventec International is a globally influential leader in advanced copper clad glass reinforced and metal backed substrate materials. Through its global presence, it has a long-standing involvement in product research and development in key areas such as military defense, aerospace, artificial intelligence, 5G, IoT, medical, automotive electronics, etc., in Asia, Europe and the United States. With its unique Copper Clad Laminate (CCL) chemical formula and advanced resin impregnation technology, Ventec has developed and offers a full range of substrate material products are used in high-frequency and high-speed applications such as radars, antennas, base stations, servers, switches, and high-end mobile phones. The company’s heat-dissipating metal substrate material (IMS) is also second to none in the world. In 2020, the company became a certified supplier of heat-dissipating materials for headlights with the largest world market share.
Company website:

BizLink (TWSE:3665)

       Bizlink is a leading manufacturer of interconnect solutions. Its products include wiring harnesses and connectors for a wide range of industries including information technology, data center, automotive, medical, solar/photovoltaic, industrial, semiconductor equipment, and optoelectronic communication equipment. Its production and operation bases span 17 locations around the world, including the United States, Mexico, China, Malaysia, Singapore, Slovakia, and Serbia. Bizlink has the capabilities to design and manufacture key components such as connectors, wiring harnesses, and printed circuit boards assemblies (PCBA). The company also provides new product engineering and rapid prototyping (NPI) as well as customized system integration and industrial machine assembly. Moreover, BizLink provides a one-stop service to seamlessly transfer mass production and manufacturing to multiple locations around the world.
Company website:

Footprintku Inc.

       Established in 2015, Footprintku Inc. utilizes its globally unique AI and automated digital conversion technology to create, a one-stop cloud service platform that accelerates the design process of electronic parts. The platform provides custom-made, ready-to-use digital data for all electronic component design needs and actively connects electronic component supply chains to launch a new generation of industrial development.
Company website:

PCB related services of the strategic platform:

PalPilot International

       In addition, related services from the strategic partners on this platform, such as the most professional and sizable PCB circuit design company in the world – PalPilot, can provide fitting designs that include high-density multilayer boards, high-speed signal boards, mixed signal boards, and blind hole / buried hole circuit board process technology. Customers are offered full-process services from raw component inventories, component configuration, to cable harness production derived from Gerber output files. They can also obtain relevant information and associated services from the platform, thereby utilizing the strategic alliance to maximize convenience. 
Company website:

PCB manufacturing factory recommendations:

       This platform can also recommend excellent PCB manufacturing factories in Europe, the United States, China, and Taiwan that work in close cooperation with Ventec International to meet your needs for a highly reliable PCB supply infrastructure.
  • Announcement Letter From Ventec International

    Feb 26, 2021

    Thank you for your long-standing support for Ventec International. We are delighted to be able to share with you that Ventec International (TWSE:6672), BizLink Holding Inc. (TWSE:3665) and Footprintku Inc. have completed the signing ceremony to seal an important strategic alliance on February 26, 2021.
  • BizLink Holding Inc, Ventec International and Footprintku Inc. Announce Strategic Alliance

    Feb 26, 2021

    Leading interconnect solutions provider, BizLink Holding Inc., announces that it has entered into a global strategic alliance with major substrate material manufacturer Ventec International and Footprintku Inc., an online EDA library and digital transformation services provider for electronic components. This alliance is formed to provide a solution that boosts product development process efficiency, and shortens development and time-to-market.
  • Utilizing AI in CAD Library Development

    Dec 19,2019

    I recently spoke with Chico Wu of Footprintku, a company using artificial intelligence (AI) to help fill gaps in CAD library development by partnering with design teams on things like addressing resource shortages and automating custom design rulesets while also eliminating other manual steps in the process.
  • Startup company Footprintku builds EDA cloud management platform

    Jan 3,2019

    Before the production of any electronic product, they must go through the Electronic Design Automation Process (EDA). In order to start designing new products, they must first go through a lengthy "pure manual" electronic component database. This results in excess time spent, wasted resources, and mistakes/errors. Founder and Chairman of the board, Yi-Chieng Huang, recalls this industry inconvenience, "This kind of thing can be done using a program. Why do you have to spend manpower and time to operate one by one?" At the time, Hwang faced a shortage of talents, and an abundance of doubts from CEO, and co-founder Yi-Ting Chen as he traveled to Kaohsiung, Taiwan from the United States in search of a group of talented engineers.
  • Taiwan startup Footprintku unveils AI-based EDA cloud platform

    Sep 10,2018

    Taiwan tech startup Footprintku (FPK) has newly released an AI-based EDA cloud management platform seeking to build universal standard design specs for electronics parts by leveraging intelligent automation and digitization services as well as innovative EDA library technologies.
  • Footprintku Creates the Industry's First AI EDA Cloud Platform

    Sep 10,2018

    TAIPEI, Taiwan - Taiwanese digital services creation company Footprintku in Taipei held a products and services seminar where the company launched their exclusive Artificial Intelligence EDA cloud platform. Footprintku has developed an EDA Library which automatically creates verification engines with the capability of creating automatic, smart, and customized electronics parts databases.